Stacked package and method for forming stacked package

ABSTRACT

A semiconductor chip module including a plurality of semiconductor chips, each provided on the side face thereof with a part of connection terminals coupled with a circuit pattern formed on the front face, the chips being stacked and bonded. The stacked element in the lowermost layer is a semiconductor chip or an interposer dedicated for attachment to an external attachment board, and having a plurality of electrode elements (e.g., solder balls) arranged on a face on the attachment side, with each electrode element connected to any one of the connection terminals by a circuit pattern. Connection terminal portions on the side faces of the respective semiconductor chips and the stacked element in the lowermost layer are interconnected by a wiring pattern extending over the side faces.

TECHNICAL FIELD

The present invention relates to a stacked package and an inter-terminalwiring method for a stacked package, which are applicable for asemiconductor chip module in which plural semiconductor chips have beenintegrated in a stacked state and its manufacturing, for example.

BACKGROUND ART

In order to deal with requirements for a recent high-density trend of asemiconductor chip (LSI) and readily deal with requirements for partialspecification changes, a three-dimensional semiconductor chip module inwhich plural semiconductor chips have been stacked, integrated, andelectrically interconnected has been proposed.

In conventional three-dimensional semiconductor chip modules, electricalconnection among semiconductor chips has been established with use of athrough hole (refer to Patent Document 1) or with use of an end face(side face) of a semiconductor chip (refer to Patent Document 2).

Also, in mounting a three-dimensional semiconductor chip module to anattachment board such as a printed wiring board, a method of connectinga terminal provided on a face of each layer to a terminal provided on aface of the attachment board by a wire is proposed.

Patent Document 1: Japanese Patent Application Public Disclosure No.2001-135785 Patent Document 2: Japanese Patent Application PublicDisclosure No. 2007-19484 Non-Patent Document 1: Craig Keast et al,“Three-Dimensional Integration Technology for Advanced Focal Planes”,3D-SIC 2007, pp. 3-1 to 13-16, March, 2007 DISCLOSURE OF THE INVENTIONProblems to be Solved by the Invention

In a method for electrically connecting semiconductor chips with use ofa through hole, a defect such as a crack easily occurs in asemiconductor chip since a through hole is provided in the extremelysmall semiconductor chip, and even when an electrical connection erroroccurs among the semiconductor chips in a semiconductor chip module inwhich the semiconductor chips are stacked and connected, the part ishard to discover and is hard to repair even if it is discovered sincethe connection is via through holes, which cannot be seen from outside.

A method for electrically connecting semiconductor chips with use of anend face (side face) of a semiconductor chip does not have the aboveproblems.

However, as for connection terminals going across the front face, sideface, and back face of the semiconductor chip, ones on the front faceand back face are formed at the time of forming the own pattern for thesemiconductor chip while one on the side face is formed separately atdifferent forming timing (and in a different forming method), and thusconnection between the connection terminal portions on the front faceand back face and the connection terminal portion on the side face maybe insufficient (a defect is easy to occur in electrical connection atthe edge portion between the front face and the side face), orelectrical characteristics in the terminals (e.g., resistance values)may extend beyond a desired range. For reference, as the side face ofthe semiconductor chip is significantly rough-edged in a state of beingcut out of a wafer, it undergoes a smoothing process, and thereafter theconnection terminal portion is formed on it by etching, adhesion offoils, etc.

Also, either in the case of using the through hole or in the case ofusing the side face, it is generally the case that adjacentsemiconductor chips are electrically connected via the connectionterminal portions, which causes low degree of freedom in arrangementposition of the connection terminal portions. Also, between thesemiconductor chips that are not adjacent to each other, the connectionterminals cannot be connected to one another, and thus a circuit kind ina connection relationship is assigned between the adjacent semiconductorchips, which causes low degree of freedom in circuit kind to be assignedto each semiconductor chip.

Further, the method of using a wire for connection between asemiconductor chip module and an attachment board has a problem in whichreliability is easily lowered by disconnection of the wire and a problemin which a connecting work to the attachment board is a troublesomework.

The present invention has been made with a view to the above respects,and an object of the present invention is to provide a stacked packageand a method for forming a stacked package enabling to reducerestriction in position of a connection terminal on a stacked packageelement and restriction in assignment of a circuit to each stackedpackage element and enabling to attach the stacked package to anattachment board easily and reliably.

Means to Solve the Problems

A first present invention is a stacked package in which a plurality ofstacked package elements, each provided on the side face thereof with apart of connection terminals coupled with a circuit pattern formed onthe front face, have been stacked and bonded, wherein (1) the stackedpackage element in the lowermost layer is dedicated for attachment to anexternal attachment board, having a plurality of electrode elementsarranged on a face on the attachment side and connecting each electrodeelement to any one of the connection terminals by a circuit pattern, andwherein (2) the stacked package element in the lowermost layer isconfigured so that connection terminal portions on the side faces of therespective stacked package elements arranged on a face on the attachmentside are interconnected by a wiring pattern extending over the sidefaces.

A second present invention is a method for forming a stacked package inwhich a plurality of stacked package elements, each provided on the sideface thereof with a part of connection terminals coupled with a circuitpattern formed on the front face, have been stacked and bonded,comprising (1) a first step of forming, on each of said stacked packageelements, said connection terminals led at least from the front face tothe side face to be coupled with said circuit pattern formed on thefront face, (2) a second step of stacking and bonding by adhesive saidplurality of stacked package elements on each of which said connectionterminals have been formed, (3) a third step of interconnectingconnection terminal portions on the side faces of said bonded respectivestacked package elements by a wiring pattern, and (4) a fourth step offorming, on a face on the attachment side of said stacked packageelement in the lowermost layer, a plurality of electrode elements to beconnected to any one of said connection terminals by a circuit pattern.

EFFECT OF THE INVENTION

With the present invention, it is possible to provide a stacked packageand a method for forming a stacked package enabling to reducerestriction in position of a connection terminal on a stacked packageelement and restriction in assignment of a circuit to each stackedpackage element and enabling to attach the stacked package to anattachment board easily and reliably.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view showing a process for manufacturing athree-dimensional semiconductor chip module according to an embodiment.

FIG. 2 is a partial schematic view showing one example of a wiringforming apparatus for use in the embodiment.

FIG. 3 is a schematic view showing a structure of a purifyingatmospheric plasma generating unit in FIG. 2.

FIG. 4 is a schematic view showing a structure of an oxygen radicalmolecule jetting unit in FIG. 2.

FIG. 5 is a bottom view of a three-dimensional semiconductor chip moduleaccording to the embodiment.

FIG. 6 is a schematic view showing a state in which thethree-dimensional semiconductor chip module according to the embodimenthas been attached to an external attachment board.

FIG. 7 is a flowchart showing a process for forming a terminal of asemiconductor chip according to the embodiment.

FIG. 8 is a schematic view showing a positional relationship between thesemiconductor chip and a nozzle in the process for forming a terminal ofa semiconductor chip according to the embodiment.

FIG. 9 is a flowchart showing a process for forming wiring amongsemiconductor chips of a semiconductor chip module in the embodiment.

DESCRIPTION OF THE SYMBOLS

10 . . . wiring forming apparatus, 50 . . . semiconductor wafer, 52 . .. semiconductor chip, 54 . . . connection terminal, 56 . . .three-dimensional semiconductor chip module main body, 58 . . .interlayer wiring, 60 . . . solder ball, 62 . . . three-dimensionalsemiconductor chip module

BEST MODE FOR CARRYING OUT THE INVENTION (A) Wiring Forming ApparatusApplied to Formation of Terminal and Side Face Wiring

Prior to description of an embodiment of a stacked package and a methodfor forming a stacked package according to the present invention, awiring forming apparatus for use in formation of a terminal of a stackedpackage and in formation of wiring among stacked package elements (amonglayers) are described. It is to be noted in the following descriptionthat a stacked package is a three-dimensional semiconductor chip module(LSI module), and that a stacked package element is a semiconductor chip(LSI).

FIG. 2 is a partial schematic view showing one example of a wiringforming apparatus 10 for use in formation of a terminal of asemiconductor chip and in formation of wiring among terminals ofsemiconductor chips of a semiconductor chip module.

FIG. 2 shows a use state in which the wiring forming apparatus 10 formswiring 14 on an object under wiring formation (hereinafter referred toas an insulating substrate in explanation in FIG. 2) 12 in considerationof simplification of explanation on the wiring forming apparatus 10.However, a use state when a terminal for extraction is formed on asemiconductor chip as described later and a use state when wiring isformed to connect connection terminals to one another amongsemiconductor chips as described later slightly differ from FIG. 2. Thatis, FIG. 2 is a view just to explain the wiring forming apparatus 10.

The wiring forming apparatus 10 includes a purifying atmospheric plasmagenerating unit 16, a paste material attaching unit 18, and an oxygenradical molecule jetting unit 20.

The purifying atmospheric plasma generating unit 16 comprises adielectric tube 22 made of a dielectric such as glass whose upper end isan inlet 22 a of gas from a gas source 30 or 32, and whose lower end isa plasma jetting outlet 22 b, a pair of electrodes 24, 24 arranged toleave a distance d1 from each other in the longitudinal direction of thedielectric tube 22 and arranged to each surround the dielectric tube 22,and a power unit 26 for applying alternating voltage or pulse voltagebetween these electrodes, as shown in FIG. 3.

To the gas inlet 22 a of the dielectric tube 22, reducing gas G1 such ascarbon monoxide gas or hydrogen gas and carrier gas Ca such as nitrogen,argon, or the like can be guided via an opening and closing valve 28. Asfor the dielectric tube 22, its plasma jetting outlet 22 b is directedto the surface of the insulating substrate 12 on which the wiring 14 isto be formed as shown in FIG. 2.

When the opening and closing valve 28 is opened, the carrier gas Ca froma carrier gas source 32 and the reducing gas G1 from a reducing gassource 30 are guided in the dielectric tube 22 toward its plasma jettingoutlet 22 b. On the flow path of the dielectric tube 22 in which thereducing gas G1 is guided, a discharge space area by dielectric barrierdischarge is formed by the pair of electrodes 24, 24 to which voltage isapplied from the power unit 26 at an area corresponding to the distanced1 between the two electrodes. Thus, the reducing gas G1 guided from thegas inlet 22 a toward the plasma jetting outlet 22 b of the dielectrictube 22 comes into a plasma state in the process of passing through thisdischarge space area. As a result, plasma gas in which this reducing gasG1 is a plasma source is jetted on the insulating substrate 12.

By this jet of the plasma gas from the dielectric tube 22, oxideremaining at a part receiving irradiation of this plasma gas iseffectively removed by chemical reaction with this plasma gas. At thistime, in the atmospheric plasma in which the reducing gas G1 is a plasmagas source, since the temperature at the irradiated part is maintainedat 60 to 80 degrees centigrade, no damage caused by heating is given tothe irradiated part and its periphery on the insulating substrate 12.

The dielectric tube 22 or the atmospheric plasma jetting nozzle 22 ofthe purifying atmospheric plasma generating unit 16 can be movedautomatically along a desired pattern with use of a known automaticcontrol mechanism although not shown in the figure. Meanwhile, insteadof the atmospheric plasma jetting nozzle 22, the insulating substrate 12side may be moved automatically along a desired pattern with use of aknown automatic control mechanism. That is, a relative movement methodbetween the atmospheric plasma jetting nozzle 22 and the insulatingsubstrate 12 may adopt any of various known methods.

To the area on the insulating substrate 12 purified by jet of theatmospheric plasma gas in which the reducing gas G1 is a plasma gassource, a paste material is supplied from a jetting outlet of a nozzle34 of the paste material attaching unit 18. By letting the nozzle 34 ofthe paste material attaching unit 18 follow the nozzle 22 of thepurifying atmospheric plasma generating unit 16, the paste material canbe supplied and attached in a line form (in a straight or curved line)sequentially on the purified area on the insulating substrate 12.

The paste material, which is a raw material to form the wiring 14,contains nano metal particles and a binder made of organic materials.

The nano metal particle in the paste material is a metal fine particlesuch as gold or silver showing favorable conductivity with a particlediameter of several nanometers to several hundreds nanometers. Such ametal fine particle has extremely high surface energy, and thus when themetal fine particles contact one another directly, metal sinteringoccurs by this contact.

The binder in the paste material acts not only to heighten attachmentforce of the paste material on the insulating substrate 12 but also toprotect the metal fine particles from sintering by preventing directcontact between the nano metal particles so as to prevent unnecessaryand unexpected metal sintering. Such a binder is conventionally wellknown as an organic binder and is made of organic materials such asoxygen, carbon, hydrogen, and nitrogen. Also, for the purpose ofheightening the protection action by the binder, it is preferable tocover the surface of each nano metal particle with a protective film ofthe binder.

For such a paste material, “NanoPaste” for sale in Harima Chemicals,Inc. is preferably used.

As a method for attaching the paste material to the insulating substrate12, a method of spraying the paste material in a mist state by a nozzleusing a similar method to an ink jet method (hereinafter referred to asmist jet) can be applied, for example. Also, the paste material may beattached to the insulating substrate appropriately by using an M3D(trademark) unit or another unit. Also, for attachment of the pastematerial to a desired part, a selection mask that selectively exposesthe desired part can be used. Further, other printing methods may beapplied. Meanwhile, the M3D (trademark) unit is a Maskless MesoscaleMaterial Deposition unit (U.S. Pat. No. 7,045,015) by Optomec. Inc,United States.

In the case of the mist jet process, jet from the nozzle 34 can benarrowed jet formed in a spiral shape to form linear wiring.

The wiring forming apparatus 10 is used for formation of a terminal of asemiconductor chip and for formation of wiring among terminals ofsemiconductor chips of a semiconductor chip module, as described later.For the former formation, the method of attaching the paste material ina mist state is preferably applied since the distance between the nozzle34 of the paste material attaching unit 18 and the attachment surface ofan object under formation changes. For the latter formation, anyattachment method may be used.

The wiring pattern portion 14 formed with the paste material in a lineform on the insulating substrate 12 receives irradiation of oxygenradical molecules by the oxygen radical molecule jetting unit 20.

This oxygen radical molecule jetting unit 20 is structured as shown inFIG. 4, for example, and basically, an atmospheric plasma generatingunit having a similar structure to the atmospheric plasma generatingunit 16 shown in FIG. 3 is used. The fundamental difference between thetwo units 16 and 20 is a respect in which the purifying atmosphericplasma generating unit 16 uses the reducing gas source 30 as a plasmagas source while the atmospheric plasma generating unit used as theoxygen radical molecule jetting unit 20 uses an oxide gas source such asoxygen or air as a plasma gas source.

That is, the atmospheric plasma generating unit 20 used as an oxygenradical molecule jetting unit comprises a dielectric tube 36 made of adielectric such as glass, a pair of electrodes 38, 38 arranged to leavea distance d2 from each other in the longitudinal direction of thedielectric tube 36 and arranged to each surround the dielectric tube 36,and a power unit 40 for applying alternating voltage or pulse voltagebetween these electrodes, as shown in FIG. 4. Also, to a gas inlet 36 a,which is an upper end of the dielectric tube 36, oxide gas G2 such asoxygen gas or air and carrier gas Ca such as nitrogen, argon, or thelike are guided via an opening and closing valve 42. As for thedielectric tube 36, its plasma jetting outlet 36 b is directed to theformed wiring portion as shown in FIG. 2.

When the opening and closing valve 42 is opened, the carrier gas Ca froma carrier gas source 46 and the oxide gas G2 from an oxide gas source 44are guided in the dielectric tube 36 toward its plasma jetting outlet 36b. On the flow path of the dielectric tube 36 in which the oxide gas G2is guided, a discharge space area by dielectric barrier discharge isformed at an area corresponding to the distance d2 between the pair ofelectrodes 38, 38 to which voltage is applied from the power unit 40.Thus, as in the case of the aforementioned atmospheric plasma generatingunit 16, the oxide gas G2 guided from the gas inlet 36 a toward theplasma jetting outlet 36 b of the dielectric tube 36 comes into a plasmastate in the process of passing through this discharge space area.

When the plasma in which the oxide gas G2 is a plasma source is jettedon the insulating substrate 12, oxygen radical contained in the plasmareacts chemically with the organic binder in the paste material of thewiring portion just attached. As a result, the organic binder is removedmainly by the chemical reaction with the oxygen radical. When theorganic binder is removed from the wiring portion formed by theaforementioned paste material, the nano metal particles in the wiringportion contact mutually. When this mutual contact occurs, the nanometal particles are sintered by the surface energy of the nano metalparticles as described above, and the wiring 14 is formed.

It is preferable to let the dielectric tube of the oxygen radicalmolecule jetting unit 20, that is to say, the nozzle 36, follow thenozzle 34 of the paste material attaching unit 18 with a predeterminedspace from the nozzle 34.

Also, it is preferable to lower the temperature of the plasma gas flowjetted from the plasma jetting outlet 36 b of the dielectric tube 36 asmuch as possible for the purpose of raising the content rate of theoxygen radical molecules in the plasma gas jetted from the nozzle 36 ofthe atmospheric plasma generating unit 20 in which the oxide gas G2 is aplasma gas source and for the purpose of restricting unnecessarytemperature rise of the insulating substrate 12. Setting the temperatureof the plasma flow jetted from the plasma jetting outlet 36 b at 200degrees centigrade, for example, raises the content rate of the oxygenradical molecules, thereby enabling to remove the organic binder in thewiring portion effectively without causing heating at the periphery andenabling to sinter the nano metal particles by spraying of the plasmagas for a short period of 30 seconds or so.

As for the operation conditions of the respective atmospheric plasmagenerating units 16, 20, at least either the rise time or the fall timeof voltage to be applied to the pairs of electrodes 24, 24 and 38, 38from the power units 26, 40 can be selected from within the range of 100microseconds or less, the repetition frequency of the waveform ofvoltage V from the power units 26, 40 can be selected from within therange of 0.5 to 1000 kHz, and the field intensity applied between thepairs of electrodes 24, 24 and 38, 38 can be selected from within therange of 0.5 to 200 kV/cm, for example. Also, it is preferable to adjustthe distance between the plasma jetting outlets 22 b, 36 b of therespective nozzles 22, 36 and the insulating substrate 12 in the rangeof 1 to 20 mm, for example.

As each of the plasma generating units 16, 20, a vacuum plasmagenerating unit may be used. However, it is preferable to use anatmospheric plasma generating unit in order to enable to perform theprocess in the atmosphere without arranging the insulating substrate 12under process in a vacuum chamber and to simplify the work and the unitby using the aforementioned atmospheric plasma generating unit.

Also, instead of spraying the oxygen radical molecules to the wiringportion formed with the paste material containing the nano metalparticles and the binder made of organic materials, spraying activeoxygen (ozone) or gas containing it can remove the organic binder in thepaste material and thus contact one another and sinter the nano metalparticles in the paste material.

Meanwhile, depending on the state of the insulating substrate 12, thepurifying process may be omitted. In this case, one that does notcomprise the purifying atmospheric plasma generating unit 16 can beapplied as the wiring forming apparatus 10.

Also, by using a similar structure to the paste material attaching unit18 of the aforementioned wiring forming apparatus 10 and adopting onecontaining an insulating substance as a paste material, an insulatinglayer or an insulating pattern can be formed by mist jet, for example.In this case, curing of the insulating layer or the insulating patternis done by ultraviolet irradiation, for example. In this case, anultraviolet irradiating unit will be provided at the position of theatmospheric plasma generating unit 20.

(3) Main Embodiment

Hereinafter, an embodiment of a stacked package and a method for forminga stacked package according to the present invention will be described.

(B-1) Process for Manufacturing Three-Dimensional Semiconductor ChipModule as Embodiment

First, a process for manufacturing a three-dimensional semiconductorchip module as an embodiment is described with reference to FIG. 1.

For example, a semiconductor wafer 50 on the surface of which circuitpatterns of plural semiconductor chips have been formed is diced intoindividual semiconductor chips 52 by dicing. It is to be noted that onlycircuit patterns of the semiconductor chips that will be in the samelayer when they are stacked are preferably formed on one wafer 50 (inother words, circuit patterns of the semiconductor chips that are indifferent layer positions of the stack are not formed on the samesemiconductor wafer).

In a case of the present embodiment, in a three-dimensionalsemiconductor chip module eventually formed, a circuit pattern of asemiconductor chip in a layer to be attached to an external attachmentboard (hereinafter referred to as an attached layer) is a circuitpattern connecting from positions at which solder balls are provided toconnection terminals 54 (54 a, 54 b) extending from a front face to aside face, and no other circuit pattern is provided (refer to FIG. 5described later). That is to say, the semiconductor chip in the attachedlayer has a function to attach the three-dimensional semiconductor chipmodule.

To each semiconductor chip 52 is formed a connection terminal 54 (54 a,54 b) continuously extending over a front face 52 a and a side face 52b.

Here, it is preferable that the angle formed by the front face 52 a andthe side face 52 b of the semiconductor chip 52 on which the connectionterminal 54 is to be formed should be an obtuse angle although it may bea right angle so as to enable to reduce a defect of the connectionterminal 54 at the edge portion. It is also preferable to chamfer theedge portion to some extent. In this case, a process of inclining theside face or chamfering is performed to each diced semiconductor chip 52in advance before the connection terminal 54 is formed on it. As aprocess of inclining the side face, end face polishing can be raised.Meanwhile, the side face may be smoothed through the inclining processto dispense with the aforementioned purifying process.

Although FIG. 1 (C) shows a case in which the connection terminals 54are provided on one side face, the number of the side faces on which theconnection terminals 54 are provided is not limited, and the connectionterminals 54 may be provided on all of the side faces.

The semiconductor chips 52-1 to 52-3 for respective layers are stackedand integrated by adhesive. Meanwhile, to prevent the connectionterminals 54 from being covered with the adhesive at the time ofintegration, it is preferable to restrict an area for applying theadhesive, to select the amount of the adhesive to be applied, and tomake the film thickness of the connection terminals 54 large. If theconnection terminals 54 are covered with the adhesive, the coveringadhesive shall be removed to expose the connection terminals 54 inadvance.

The side face of a three-dimensional semiconductor chip module 56 formedin this manner is in a state where only the connection terminals 54-1 to54-3 of the semiconductor chips 52-1 to 52-3 in the respective layersare formed, and interlayer wiring 58 is formed to electrically connectthese connection terminals 54-1 to 54-3 in different layers in apredetermined wiring pattern.

In a case where the angle formed by the front face 52 a and the sideface 52 b of each semiconductor chip 52 is an obtuse angle, the sideface in each layer just needs to be inclined so that the side faces inthe respective layers may become a flat face as a whole.

Also, even when the side faces in the respective layers cannot form aflat face as a whole due to production tolerance in the semiconductorchips 52 in the respective layers to produce unevenness, the followingmeasures are preferable to enable to alleviate the negative effect ofthe unevenness. That is, it is only necessary to attach the respectivelayers by applying more adhesive for adhesion among the respectivelayers than the amount required for mere adhesion and form protrusion ofthe adhesive so as to alleviate the unevenness by the protrusion of theadhesive. Also, the jetting amount of an inter-layer material by thewiring forming apparatus 10 is increased to the uneven part to preventcracking.

On the attached layer (lowermost layer) of the three-dimensionalsemiconductor chip module main body 56 formed in the above manner areprovided solder balls (bump electrodes) 60 for attaching it to anexternal attachment board.

Resin molding by a synthetic resin or the like may be performed to thethree-dimensional semiconductor chip module main body 56 except thebottom face of the attached layer. The molding may be performed beforeor after attaching the solder balls 60.

FIG. 5 is a bottom view of a completed three-dimensional semiconductorchip module 62. FIG. 5 (A) shows an example of arranging the solderballs 60 around the bottom face close to the side faces, and FIG. 5 (B)shows a layout of the solder balls 60 of a two-dimensional BGA (BallGrid Array) type. Both the arrangements have many connection points tothe external attachment board and can achieve stable attachment.

The completed three-dimensional semiconductor chip module 62 is attachedto an external attachment board 64 by C4 (Controlled Collapsed ChipConnection), for example, as shown in FIG. 6.

(B-2) Process for Forming Terminal of Semiconductor Chip

Next, a process for forming a connection terminal on a semiconductorchip is explained in details with reference to a flowchart in FIG. 7.

The process for forming a connection terminal includes an insulatingmaterial attaching step S1, an insulating material curing step S2, aconductive material attaching step S3, and a conductive material curingstep S4 in this order. It is noted that different steps may be processedin parallel.

The insulating material attaching step S1 is a step of attaching aninsulating material to a partial area of a predetermined area to which aconnection terminal is provided. The insulating material curing step S2is a step of curing the insulating material attached to thesemiconductor chip 52. The conductive material attaching step S3 is astep of attaching a conductive material that will be a connectionterminal. The conductive material curing step S4 is a step of curing theconductive material attached to the semiconductor chip 52.

In any of the steps, the semiconductor chip is installed so that thefront face 52 a of the semiconductor chip 52 may be at a predeterminedangle with a reference plane REF, and so that the side face on which theconnection terminal 54 is provided may be on the far side from thereference plane REF with use of a dedicated inclined mounting table, amounting jig, etc., for example, as shown in FIG. 8. The predeterminedangle is theta/2 in a case where the angle formed by the front face 52 aand the side face 52 b of the semiconductor chip 52 is theta, forexample. When theta is 90 degrees, the installation angle is 45 degrees.It is to be noted that a nozzle 70 shown in FIG. 8 differs with the stepand jets a different material.

In the insulating material attaching step S1, an insulating material ina mist state is jetted from the nozzle 70 shown in FIG. 8, for example.At this time, the jetting nozzle 70 and the semiconductor chip 52 aremoved relatively. The relative movement of the nozzle 70 jetting theinsulating material against the semiconductor chip 52 is linear movementfor reverse movement) traveling from the side face 52 b of thesemiconductor chip 52 via the edge to a predetermined position on thefront face 52 a, and with one sequential mist jet process, theinsulating material is attached to an area (except a connection areawith a circuit pattern) approximately covering an area on which theconnection terminal 54 is to be provided. Meanwhile, in a case where astable insulating layer has been provided on the front face of thesemiconductor chip 52 on which the connection terminal 54 is to beprovided by a process at the time of forming the circuit pattern of thesemiconductor chip 52, the insulating material may be attached only tothe side face 52 b of the semiconductor chip 52.

Meanwhile, prior to the insulating material attaching step S1, theaforementioned purifying process may be performed. Also, the insulatingmaterial attaching step S1 may adopt an attachment method other than themist jet process. For example, a method of applying an insulatingmaterial paste may be applied.

A curing method in the insulating material curing step S2 is notlimited. In the insulating material curing step S2, a not shownultraviolet irradiation head may follow the nozzle 70 jetting theinsulating material to cure the insulating material attached to thesemiconductor chip 52, for example. Also, the semiconductor chip 52 towhich the insulating material has been attached may pass through atunnel in the inside of which ultraviolet is irradiated to cure theinsulating material, for example.

In the conductive material attaching step S3, a conductive material thatwill be a connection terminal 54 is attached to the semiconductor chip52 by the paste material attaching unit 18 of the aforementioned wiringforming apparatus 10 adopting the mist jet process. That is, at the sametime as jetting the mist-like conductive material from the nozzle 70shown in FIG. 8, the jetting nozzle 70 and the semiconductor chip 52 aremoved relatively, to attach the conductive material that will be aconnection terminal 54 in a line form by one sequential mist jetprocess.

As described above, in the case of the mist jet process, jet from thenozzle 70 can be narrowed jet formed in a spiral shape to form linearwiring. Here, controlling the distance between the nozzle 70 and thesemiconductor chip 52 can achieve a desired line width by the mist jetprocess. One end of the connection terminal 54 on the side face may bewidened to function as a pad.

The conductive material curing step S4 is one in which the conductivematerial attached to the semiconductor chip 52 is cured by the oxygenradical molecule jetting unit 20 of the aforementioned wiring formingapparatus 10 and is completed as a connection terminal 54.

Here, by preceding the nozzle for attaching the insulating material andthe irradiation head for curing the insulating material before thenozzle for attaching the conductive material and by relatively moving,against the semiconductor chip 52, the nozzle for attaching theinsulating material, the irradiation head for curing the insulatingmaterial, the nozzle for attaching the conductive material, and thenozzle for curing the conductive material as a set, the respective stepsin the process for forming a connection terminal can be performed inparallel.

(B-3) Process for Forming Wiring Among Semiconductor Chips ofSemiconductor Chip Module

Next, a process for forming wiring among semiconductor chips (amonglayers) of a semiconductor chip module is explained in details withreference to a flowchart in FIG. 9.

The process for forming wiring among semiconductor chips also includesan insulating material attaching step S11, an insulating material curingstep S12, a conductive material attaching step S13, and a conductivematerial curing step S14 in this order. Here, in a case whereintersection exists in wiring to be formed, an insulating materialattaching step S15, an insulating material curing step S16, a conductivematerial attaching step S17, and a conductive material curing step S18are further required to form wiring on the upper side in theintersection. It is noted that different steps may be processed inparallel.

The insulating material attaching steps S11, 515, the insulatingmaterial curing steps S12, 516, the conductive material attaching stepsS13, S17, and the conductive material curing steps S14, S18 areprocesses similar to the similar steps S1, S2, S3, S4 in the process forforming a terminal of a semiconductor chip, respectively.

Meanwhile, since an object on which wiring is formed is a whole sideface of a three-dimensional semiconductor chip module 62 having theconnection terminals 54, the whole side face needs to be opposed to thevarious nozzles.

Also, a wiring pattern to be formed in the process for forming wiringamong semiconductor chips may be arbitrary as illustrated in FIG. 1, andformation of such an arbitrary wiring pattern is executed by controllingthe positions of the various nozzles by an NC (numerical control)system, for example.

The method for forming the insulating pattern is not limited to theabove method. For example, instead of the insulating material attachingstep S11 and the insulating material curing step S12 or the insulatingmaterial attaching step S15 and the insulating material curing step 516,the following method for forming the insulating pattern may be applied.An insulating film (polyimide, glass, etc.) on which holes (includingelongated holes) have been opened at necessary parts by laser in advanceis attached to the side face to insulate the parts. In this case, wiringis provided on the insulating film.

(B-4) Effect of Embodiment

With the above embodiment, since the connection terminal on the frontface and the side face of the semiconductor chip is formed continuouslyby one-time forming operation to which the mist jet process has beenapplied, the terminal portion on the front face and the terminal portionon the side face are connected reliably.

Also, with the above embodiment, using the mist jet process can form anarbitrary wiring pattern on the side face of the semiconductor chipmodule on which the connection terminals of the respective semiconductorchips are provided. By doing so, the connection terminals of thesemiconductor chips that are not adjacent to each other can be connecteddirectly, for example. As a result, the degree of freedom in assignmentof a circuit to each semiconductor chip can be heightened, and thedegree of freedom in position of the connection terminal of eachsemiconductor chip can be heightened. That is, the degree of freedom indesign can be heightened.

Further, with the above embodiment, since the semiconductor chip in theattached layer (lowermost layer) is made to be a layer dedicated forattachment, and the solder balls are provided in the peripheralarrangement or in the two-dimensional BGA-type arrangement, attachmentto the external attachment board can be done easily. Also, the wiringpattern on the external attachment board to be connected to thesemiconductor chip module can be designed easily.

Here, since the attached layer is also made of a semiconductor chipsimilar to each of the other layers, it is influenced (e.g., thermalexpansion) by heating at the time of operation of the semiconductor chipmodule in a similar manner to that of each of the other layers and canbe prevented from being detached beforehand.

(C) Other Embodiments

Although the above embodiment has shown the attached layer (lowermostlayer) of the semiconductor chip module made of a semiconductor chip,the attached layer (lowermost layer) may be an interposer. Here, usingthe same material as the semiconductor chips in the other layers to makethe interposer is a preferred embodiment since the influence by heat issimilar. For example, when a board material of the semiconductor chipsis silicon, a material of the interposer shall also be silicon. Also, asa material of the interposer, ceramic, having high resistivity andresistant to thermal deformation, may be applied.

Also, although the above embodiment has shown a case of attaching thesolder balls after the integrating process is finished, the solder ballsmay be attached to the semiconductor chip (or the interposer) in theattached layer before integration, and then the attached layer elementto which the solder balls have been attached may be integrated.

Further, although the above embodiment has shown the electrode elementsto be electrically connected to the external attachment board that aresolder balls, they may be other electrode elements. For example, theymay be other bump electrodes or planar electrodes. Also, for example,they may be electrode elements of the semiconductor chip module to be itin electrode elements of the external attachment board in projection andrecess shapes, and electrode elements of the external attachment boardmay be prepared as a socket.

Still further, although only the lowermost layer of the semiconductorchip module is an attached layer in the above embodiment, the lowermostlayer and the uppermost layer may be attached layers, and thesemiconductor chip module may be mounted to be clamped between twoexternal attachment boards. In this case, solder balls will be arrangedon the upper face of the uppermost layer.

INDUSTRIAL APPLICABILITY

A stacked package element and a method for forming a stacked packageaccording to the present invention can be applied to another stackedpackage such as a stacked printed wiring board, as well as they cantarget a three-dimensional semiconductor chip module (LSI module).

1. A stacked package in which a plurality of stacked package elements,each provided on the side face thereof with a part of connectionterminals coupled with a circuit pattern formed on the front face, havebeen stacked and bonded, wherein said stacked package element in thelowermost layer is dedicated for attachment to an external attachmentboard, having a plurality of electrode elements arranged on a face onthe attachment side and connecting said each electrode element to anyone of said connection terminals by a circuit pattern, and wherein thestacked package element in the lowermost layer is configured so thatconnection terminal portions on the side faces of the respective stackedpackage elements arranged on a face on the attachment side areinterconnected by a wiring pattern extending over the side faces.
 2. Thestacked package according to claim 1, wherein said electrode elementsprovided on said stacked package element in the lowermost layer aresolder balls.
 3. The stacked package according to claim 1, wherein saidstacked package element in the lowermost layer is formed in a similarmanner to that of each of said stacked package elements in the otherlayers except the formation of said electrode elements.
 4. The stackedpackage according to claim 1, wherein said stacked package element inthe lowermost layer is an interposer made of the same semiconductormaterial as a board material of each of said stacked package elements inthe other layers.
 5. The stacked package according to claim 1, whereinsaid stacked package element in the lowermost layer is an interposermade of ceramic.
 6. The stacked package according to claim 5, whereinsaid plurality of electrode elements are arranged on the periphery. 7.The stacked package according to claim 5, wherein said plurality ofelectrode elements are arranged in a two-dimensional BGA type.
 8. Amethod for forming a stacked package in which a plurality of stackedpackage elements, each provided on the side face thereof with a part ofconnection terminals coupled with a circuit pattern formed on the frontface, have been stacked and bonded, comprising: a first step of forming,on each of said stacked package elements, said connection terminals ledat least from the front face to the side face to be coupled with saidcircuit pattern formed on the front face; a second step of stacking andbonding by adhesive said plurality of stacked package elements on eachof which said connection terminals have been formed; a third step ofinterconnecting connection terminal portions on the side faces of saidbonded respective stacked package elements by a wiring pattern; and afourth step of forming, on a face on the attachment side of said stackedpackage element in the lowermost layer, a plurality of electrodeelements to be connected to any one of said connection terminals by acircuit pattern.
 9. The method for forming a stacked package accordingto claim 8, wherein said fourth step is executed after said third step.10. The method for forming a stacked package according to claim 8,wherein said fourth step is executed before execution of said thirdstep.
 11. The stacked package according to claim 1, wherein saidplurality of electrode elements are arranged on the periphery.
 12. Thestacked package according to claim 2, wherein said plurality ofelectrode elements are arranged on the periphery.
 13. The stackedpackage according to claim 3, wherein said plurality of electrodeelements are arranged on the periphery.
 14. The stacked packageaccording to claim 4, wherein said plurality of electrode elements arearranged on the periphery.
 15. The stacked package according to claim 1,wherein said plurality of electrode elements are arranged in atwo-dimensional BGA type.
 16. The stacked package according to claim 2,wherein said plurality of electrode elements are arranged in atwo-dimensional BGA type.
 17. The stacked package according to claim 3,wherein said plurality of electrode elements are arranged in atwo-dimensional BGA type.
 18. The stacked package according to claim 4,wherein said plurality of electrode elements are arranged in atwo-dimensional BGA type.